We are incorporated in 2016 in California with offices in Santa Clara and affiliates in Taiwan and China (Shanghai and Chengdu). Our primary focus are advanced technologies and hyperscale storage solutions. Goke US Lab is committed to developing solutions for smart set-top boxes, intelligent surveillance, and hyperscale storage. Our engineering teams are led by veterans from Marvell, Micron, Microsemi, Broadcom, and Apple.
We perform contract research and development services that include architecture definition and design services for implementation of integrated circuits and system on chips. These have led to successful implementations of SSD products.
Mr. Po-Chien Chang graduated with a master’s degree in electrical and electronic engineering. He was selected as one of the “Hundred Talents Program” in Hunan Province back in 2016. In 2017, he was invited to be spokesperson for Changsha Talent New Deal. In 2018, he was selected as the leading talent of Changsha “3635 Talent Plan.”
He worked as a design engineer for Intel Corporation in the United States from April 1995 to June 1998, and a system engineer, Integrated IC Design Manager, R&D Director, and Vice President (Storage Networking Engineering VP) at Marvell Semiconductor from July 1998 to March 2016. He is the CEO of Hunan Goke Storage Technology from July 2018 to present. Since Mr. Chang joined the company, he has helped the company plan strategic development direction, clarify development goals, consolidate the talent base, and promote successful research and development of important research and development projects.
Mr. Guangfeng Wang graduated from Tsinghua University in 1994 with a degree in physics and graduated from the University of Southern California in electrical engineering in 1999. From 2000 to 2019, he served as the Senior Engineer Director of Marvell Semiconductor and in 2018 at Goke US Research Lab.
He has nearly 30 invention patents, proficient in SOC Integration, SATA, SAS, PCIe, MIPI, DDR design, CPU peripheral protocol (UART, SPI, I2C, etc.) design, NVMe, UFS, AHCI design, CPU structure and application, and SSD chip architecture.